Patent Assignment
Reel/Frame 027082/0495
Assignment of Assignor's Interest
Recorded: 2011-10-19
Pages: 2
Assignor
YOKOYAMA, KENJI
Executed: 2011-08-01
Assignee
PANASONIC CORPORATION
1006 OAZA KADOMA, KADOMA-SHI, OSAKA, 571-8501, JAPAN
Covered Property
(1)
Semiconductor Chip Having Staggered Arrangement of Bonding Pads