Patent Assignment
Reel/Frame 027087/0206
Assignment of Assignor's Interest
Recorded: 2011-09-23
Pages: 5
Assignor
SHEN, GENG-SHIN
Executed: 2011-09-09
Assignee
CHIPMOS TECHNOLOGIES, INC.
NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK,, HSINCHU, TAIWAN
Covered Properties
(2)
Chip Package Structure and Method for Manufacturing the Same
Solder Cap Bump in Semiconductor Package and Method of Manufacturing the Same