IP Library Assignment 027109/0161
Patent Assignment
Reel/Frame 027109/0161

Assignment of Assignor's Interest

Recorded: 2011-10-24 Pages: 9
Assignors
CHUN, HYUNA
Executed: 2011-09-07
CHOI, JAEBONG
Executed: 2011-09-07
LEE, SUNGWON
Executed: 2011-09-07
RYU, SUNGWUK
Executed: 2011-09-07
LEE, HYUKSOO
Executed: 2011-09-07
EOM, SAIRAN
Executed: 2011-09-07
Assignee
LG INNOTEK CO., LTD.
20TH FLOOR, SEOUL SQUARE 541, NAMDAEMUNNO 5-GA, JUNG-GU, SEOUL, 100-714, KOREA, REPUBLIC OF
Covered Property (1)
Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof
Patent: 8,956,919 →
Application: 13/142,172 →
Publication: US 2012/0038036
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest May 8, 2015
From: LG INNOTEK CO., LTD.
To: ALS CO., LTD.
Reel/Frame 035598/0488 →
Change of Name May 14, 2025
From: ALS CO., LTD.
To: INNOTRO CO., LTD.
Reel/Frame 071275/0763 →