Assignment of Assignor's Interest

Recorded: 2011-10-31 Pages: 3

Assignor

YANG, JUN

Executed: 2011-09-23

Assignees

AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE, ZHONGSHAN CITY, GUANGDONG PROVINCE, CHINA

66,CHUNG SHAN ROAD, TU-CHENG, NEW TAIPEI, TAIWAN

Covered Property (1)

Semiconductor Chip Package and Method of Making Same

Patent: 8,614,120 →

Application: 13/286,094 →

Publication: US 2013/0075879

Related Assignments (2)

Other recorded transfers of the patent in this record — the chain of ownership.