IP Library › Assignment 030400/0124
Patent Assignment
Reel/Frame 030400/0124

Assignment of Assignor's Interest

Recorded: 2013-05-13 Pages: 3
Assignor
Assignee
AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.,ZHONGSHAN TORCH HI-TECH DEVELOPMENT ZONE, ZHONGSHAN, CHINA
Covered Property (1)
Semiconductor Chip Package and Method of Making Same
Patent: 8,614,120 →
Application: 13/286,094 →
Publication: US 2013/0075879
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Oct 31, 2011
From: YANG, JUN
To: AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.; HON HAI PRECISION INDUSTRY CO., LTD.
Reel/Frame 027150/0934 →
Change of Name Jul 23, 2014
From: AMBIT MICROSYSTEMS (ZHONGSHAN) LTD.
To: SHUNSIN TECHNOLOGY (ZHONG SHAN) LIMITED
Reel/Frame 033394/0572 →