Patent Assignment
Reel/Frame 027157/0173
Assignment of Assignor's Interest
Recorded: 2011-11-01
Pages: 3
Assignors
PARK, SUNG SU
Executed: 2011-10-31
RYU, KYUNG HAN
Executed: 2011-10-31
LEE, SANG MOK
Executed: 2011-10-31
Assignee
AMKOR TECHNOLOGY, INC.
1900 SOUTH PRICE ROAD, CHANDLER, ARIZONA, 85286-6604
Covered Property
(1)
Wafer Level Chip Scale Package and Method of Fabricating Wafer Level Chip Scale Package
Patent:
8,828,802 →
Application:
13/286,903 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Patent Security Agreement
May 7, 2015
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 035613/0592 →
Security Interest
Aug 1, 2018
From: AMKOR TECHNOLOGY, INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 046683/0139 →
Assignment of Assignor's Interest
Oct 12, 2020
From: AMKOR TECHNOLOGY, INC.
To: AMKOR TECHNOLOGY SINGAPORE HOLDING PTE.LTD.
Reel/Frame 054046/0673 →