IP Library › Assignment 027165/0612
Patent Assignment
Reel/Frame 027165/0612

Assignment of Assignor's Interest

Recorded: 2011-11-02 Pages: 5
Assignors
KERDILES, SEBASTIEN
Executed: 2006-02-15
DURET, CARINE
Executed: 2006-02-15
VAUFREDAZ, ALEXANDRE
Executed: 2006-02-15
METRAL, FREDERIC
Executed: 2006-02-15
Assignee
S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
PARC TECHNOLOGIQUE DES FONTAINES, CHEMIN DES FRANQUES, 38190 BERNIN, FRANCE
Covered Properties (2)
Equipment for Bonding by Molecular Adhesion
Patent: 8,091,601 →
Application: 12/489,800 →
Publication: US 2009/0294072
Process for Bonding by Molecular Adhesion
Patent: 8,158,013 →
Application: 12/490,132 →
Publication: US 2009/0261064
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Change of Name Mar 1, 2012
From: S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
To: SOITEC
Reel/Frame 027793/0535 →