IP Library Assignment 027219/0106
Patent Assignment
Reel/Frame 027219/0106

Assignment of Assignor's Interest

Recorded: 2011-11-14 Pages: 2
Assignor
ADVANCED MICRO DEVICES, INC.
Executed: 2011-11-11
Assignee
GLOBALFOUNDRIES INC.
P.O. BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Method of Fabricating a Metal Cap Layer with Enhanced Etch Resistivity for Copper-Based Metal Regions in Semiconductor Devices
Patent: 8,084,354 →
Application: 12/493,366 →
Publication: US 2010/0078821
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 29, 2009
From: KAHLERT, VOLKER; STRECK, CHRISTOF
To: ADVANCED MICRO DEVICES, INC.
Reel/Frame 022885/0734 →
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →