IP Library Assignment 027250/0661
Patent Assignment
Reel/Frame 027250/0661

Assignment of Assignor's Interest

Recorded: 2011-11-18 Pages: 9
Assignors
AKAO, TOKUNOBU
Executed: 2011-09-26
OGAWA, UNRYU
Executed: 2011-09-26
OKUNO, MASAHISA
Executed: 2011-09-26
YASHIMA, SHINJI
Executed: 2011-09-26
UMEKAWA, ATSUSHI
Executed: 2011-09-26
MINAMI, KAICHIRO
Executed: 2011-09-26
Assignee
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 1018980, JAPAN
Covered Property (1)
Substrate Processing Apparatus and Method of Manufacturing a Semiconductor Device
Patent: 8,557,720 →
Application: 13/242,690 →
Publication: US 2012/0108061
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2018
From: HITACHI KOKUSAI ELECTRIC INC.
To: KOKUSAI ELECTRIC CORPORATION
Reel/Frame 047995/0490 →