Patent Assignment
Reel/Frame 027265/0526
Assignment of Assignor's Interest
Recorded: 2011-11-22
Pages: 2
Assignors
LIN, SIMON-SU-HORNG
Executed: 2009-12-23
YANG, CHI-MING
Executed: 2009-12-24
CHERN, CHYI SHYUAN
Executed: 2009-12-24
LIN, CHIN-HSIANG
Executed: 2009-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD.VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Integration of Bottom-Up Metal Film Deposition