Assignment of Assignor's Interest

Recorded: 2011-12-13 Pages: 2

Assignors

NG, MAN CHUNG

Executed: 2011-11-23

CHAN, WAI LIK

Executed: 2011-11-24

WONG, KWOK KEI

Executed: 2011-11-24

Assignee

2 YISHUN AVENUE 7, SINGAPORE, 768924, SINGAPORE

Covered Property (1)

Apparatus for Bonding Substrates to Each Other

Patent: 8,905,109 →

Application: 13/323,478 →

Publication: US 2013/0149839

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.