IP Library › Assignment 027395/0361
Patent Assignment
Reel/Frame 027395/0361

Assignment of Assignor's Interest

Recorded: 2011-12-15 Pages: 4
Assignors
CHEN, KUAN-NENG
Executed: 2011-09-06
HSU, SHENG-YAO
Executed: 2011-09-06
Assignee
NATIONAL CHIAO TUNG UNIVERSITY
NO. 1001, DAXUE RD., EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Property (1)
Bonding Method for Three-Dimensional Integrated Circuit and Three-Dimensional Integrated Circuit Thereof
Patent: 8,508,041 →
Application: 13/325,587 →
Publication: US 2013/0069248
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger and Change of Name Nov 24, 2021
From: NATIONAL CHIAO TUNG UNIVERSITY; NATIONAL YANG MING UNIVERSITY
To: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
Reel/Frame 058237/0138 →
Assignment of Assignor's Interest Jan 4, 2022
From: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 058532/0268 →