IP Library › Assignment 058237/0138
Patent Assignment
Reel/Frame 058237/0138

Merger and Change of Name

Recorded: 2021-11-24 Pages: 5
Assignors
NATIONAL CHIAO TUNG UNIVERSITY
Executed: 2021-02-01
NATIONAL YANG MING UNIVERSITY
Executed: 2021-02-01
Assignee
NATIONAL YANG MING CHIAO TUNG UNIVERSITY
NO. 1001, UNIVERSITY RD. EAST DIST., HSINCHU CITY, 300, TAIWAN
Covered Properties (2)
Bonding Method for Three-Dimensional Integrated Circuit and Three-Dimensional Integrated Circuit Thereof
Patent: 8,508,041 →
Application: 13/325,587 →
Publication: US 2013/0069248
Submicron Connection Layer and Method for Using the Same to Connect Wafers
Patent: 8,951,837 →
Application: 13/605,849 →
Publication: US 2014/0008801
Related Assignments (3)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 15, 2011
From: CHEN, KUAN-NENG; HSU, SHENG-YAO
To: NATIONAL CHIAO TUNG UNIVERSITY
Reel/Frame 027395/0361 →
Assignment of Assignor's Interest Oct 15, 2012
From: CHEN, KUAN-NENG; CHANG, YAO-JEN
To: NATIONAL CHIAO TUNG UNIVERSITY
Reel/Frame 029127/0843 →
Assignment of Assignor's Interest Jan 4, 2022
From: NATIONAL YANG MING CHIAO TUNG UNIVERSITY
To: HANNSTAR DISPLAY CORPORATION
Reel/Frame 058532/0268 →