IP Library Assignment 027404/0502
Patent Assignment
Reel/Frame 027404/0502

Assignment of Assignor's Interest

Recorded: 2011-12-16 Pages: 2
Assignor
NGUYEN, TUE
Executed: 2011-12-16
Assignee
TEGAL CORPORATION
2201 S. MCDOWELL BOULEVARD, PETALUMA, CALIFORNIA, 94954
Covered Property (1)
Multilayer Copper Structure for Improving Adhesion Property
Patent: 7,087,522 →
Application: 10/795,950 →
Publication: US 2004/0171251
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Oct 16, 2014
From: TEGAL CORPORATION
To: COLLABRX, INC.
Reel/Frame 033960/0863 →
Assignment of Assignor's Interest Oct 16, 2014
From: COLLABRX, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
Reel/Frame 033960/0890 →