Patent Assignment
Reel/Frame 033960/0890
Assignment of Assignor's Interest
Recorded: 2014-10-16
Pages: 5
Assignor
COLLABRX, INC.
Executed: 2013-08-13
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Properties
(6)
Multilayered Diffusion Barrier Structure for Improving Adhesion Property
Patent:
6,495,449 →
Application:
09/520,107 →
Multilayered Copper Structure for Improving Adhesion Property
Multilayered Diffusion Barrier Structure for Improving Adhesion Property
Method to Deposit an Impermeable Film on Porous Low-K Dielectric Film
Method to Plasma Deposit on Organic Polymer Dielectric Film
Multilayer Copper Structure for Improving Adhesion Property
Related Assignments
(9)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 23, 2002
From: NGUYEN, TUE
To: SIMPLUS SYSTEMS CORPORATION
Reel/Frame 013236/0561 →
Assignment of Assignor's Interest
Nov 13, 2002
From: NGUYEN, TUE; NGUYEN, TAI DUNG
To: SIMPLUS SYSTEMS CORPORATION
Reel/Frame 013491/0374 →
Assignment of Assignor's Interest
Feb 4, 2003
From: ZHANG, ZHIHONG; NGUYEN, TAI DUNG; NGUYEN, TUE
To: SIMPLUS SYSTEMS CORPORATION
Reel/Frame 013756/0609 →
Assignment of Assignor's Interest
Feb 4, 2003
From: ZHANG, ZHIHONG; NGUYEN, TAI DUNG; NGUYEN, TUE
To: SIMPLUS SYSTEMS CORPORATION
Reel/Frame 013756/0560 →
Assignment of Assignor's Interest
Feb 10, 2004
From: NGUYEN, TUE
To: SIMPLUS SYSTEMS CORPORATION
Reel/Frame 014321/0821 →
Assignment of Assignor's Interest
Feb 11, 2004
From: SIMPLUS SYSTEMS CORPORATION
To: TEGAL CORPORATION
Reel/Frame 014327/0484 →
Assignment of Assignor's Interest
Mar 18, 2004
From: SIMPLUS SYSTEMS CORPORATION
To: TEGAL CORPORATION
Reel/Frame 015083/0228 →
Assignment of Assignor's Interest
Dec 16, 2011
From: NGUYEN, TUE
To: TEGAL CORPORATION
Reel/Frame 027404/0502 →
Change of Name
Oct 16, 2014
From: TEGAL CORPORATION
To: COLLABRX, INC.
Reel/Frame 033960/0863 →