IP Library Granted Patent US 6,777,331
Granted Patent Utility
US 6,777,331 · Confirmation No. 8331

MULTILAYERED COPPER STRUCTURE FOR IMPROVING ADHESION PROPERTY

Inventor: Tue Nguyen
⬇ PDF
Code Description Pages PDF
2015-01-11 IMIS Miscellaneous Internal Document 1 View
2004-04-12 PA.. Power of Attorney 2 View
2002-08-23 TRNA Transmittal of New Application 4 View
2002-08-23 SPEC Specification 26 View
2002-08-23 CLM Claims 5 View
2002-08-23 ABST Abstract 1 View
2002-08-23 DRW Drawings-only black and white line drawings 2 View
2002-08-23 OATH Oath or Declaration filed 2 View
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this application's details
Quick Facts
Patent No.
US 6,777,331
App. No.
10/225,920
Filed
2002-08-23
Granted
2004-08-17
Pub. No.
US20030013302A1
Art Unit
2825
PTA
-1 days