IP Library › Assignment 013236/0561
Patent Assignment
Reel/Frame 013236/0561

Assignment of Assignor's Interest

Recorded: 2002-08-23 Pages: 3
Assignor
NGUYEN, TUE
Executed: 2002-08-17
Assignee
SIMPLUS SYSTEMS CORPORATION
40737 ENCYCLOPEDIA CIRCLE, FREMONT, CALIFORNIA, 94538
Covered Property (1)
Multilayered Copper Structure for Improving Adhesion Property
Patent: 6,777,331 →
Application: 10/225,920 →
Publication: US 2003/0013302
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 11, 2004
From: SIMPLUS SYSTEMS CORPORATION
To: TEGAL CORPORATION
Reel/Frame 014327/0484 →
Assignment of Assignor's Interest Mar 18, 2004
From: SIMPLUS SYSTEMS CORPORATION
To: TEGAL CORPORATION
Reel/Frame 015083/0228 →
Change of Name Oct 16, 2014
From: TEGAL CORPORATION
To: COLLABRX, INC.
Reel/Frame 033960/0863 →
Assignment of Assignor's Interest Oct 16, 2014
From: COLLABRX, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
Reel/Frame 033960/0890 →