IP Library › Assignment 027418/0927
Patent Assignment
Reel/Frame 027418/0927

Merger

Recorded: 2011-12-20 Pages: 3
Assignor
Assignee
UNIMICRON TECHNOLOGY CORP.
NO. 38 HSING PONG RD., KWEI SAN INDUSTRIAL ZONE, TAOYUAN, TAIWAN
Covered Property (1)
Packaging Substrate with Conductive Structure
Patent: 8,101,866 →
Application: 12/175,348 →
Publication: US 2009/0020322
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jul 17, 2008
From: HSU, SHIH-PING
To: PHOENIX PRECISION TECHNOLOGY CORPORATION
Reel/Frame 021259/0980 →