Patent Assignment
Reel/Frame 027476/0906
Assignment of Assignor's Interest
Recorded: 2012-01-04
Pages: 3
Assignor
JUNG, JONG-KI
Executed: 2011-10-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
416, MAETAN-DONG, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Metal Silicide Layer and Fabrication Method Thereof