Patent Assignment
Reel/Frame 027502/0255
Assignment of Assignor's Interest
Recorded: 2012-01-09
Pages: 3
Assignors
BARRIE, KEITH LAKE
Executed: 2011-12-15
PANGRLE, SUZETTE K.
Executed: 2011-12-15
VILLAVICENCIO, GRANT
Executed: 2011-12-11
LEAL, JEFFREY S.
Executed: 2011-12-15
Assignee
VERTICAL CIRCUITS, INC.
10 VICTOR SQUARE, SCOTTS VALLEY, CALIFORNIA, 95066
Covered Properties
(2)
Semiconductor Die Having Fine Pitch Electrical Interconnects
Semiconductor die having fine pitch electrical interconnects
Application:
61/393,311 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 24, 2012
From: VERTICAL CIRCUITS, INC.
To: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
Reel/Frame 029186/0755 →
Assignment of Assignor's Interest
Dec 6, 2012
From: VERTICAL CIRCUITS (ASSIGNMENT FOR THE BENEFIT OF CREDITORS), LLC
To: INVENSAS CORPORATION
Reel/Frame 029458/0905 →
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →