Patent Assignment
Reel/Frame 027539/0521
Assignment of Assignor's Interest
Recorded: 2012-01-17
Pages: 2
Assignors
MORI, KENTARO
Executed: 2011-11-11
NAKASHIMA, YOSHIKI
Executed: 2011-11-11
OHSHIMA, DAISUKE
Executed: 2011-11-11
KIKUCHI, KATSUMI
Executed: 2011-11-11
YAMAMICHI, SHINTARO
Executed: 2011-11-11
Assignee
NEC CORPORATION
7-1, SHIBA 5-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Manufacture in Which Minimum Wiring Pitch of Connecting Portion Wiring Layer Is Less Than Minimum Wiring Pitch of Any Other Wiring Layer