Patent Assignment
Reel/Frame 027595/0852
Corrective Assignment to Correct the Inventor Name "Nadium F. Haddad" Previously Recorded on Reel 006542 Frame 0707. Assignor(S) Hereby Confirms the Inventor Name Is "Nadim F. Haddad".
Recorded: 2012-01-25
Pages: 3
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
OLD ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Method of Forming a Frontside Contact to the Silicon Substrate of a Soi Wafer
Patent:
5,314,841 →
Application:
08/054,992 →
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Correction to the Recordation Cover Sheet of the Assignee Recorded at 008430/0312 on 12/23/1996
Dec 14, 2011
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LOCKHEED MARTIN FEDERAL SYSTEMS, INC.
Reel/Frame 027380/0841 →
Assignment of Assignor's Interest
Jan 8, 2012
From: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
To: OAL DATA LIMITED LIABILITY COMPANY
Reel/Frame 027497/0554 →
Corrective Assignment to Correct the Conveying Assignor Previously Recorded on Reel 008732 Frame 0103. Assignor(S) Hereby Confirms the Assignor Is "Lockheed Martin Federal Systems, Inc.".
Jan 25, 2012
From: LOCKHEED MARTIN FEDERAL SYSTEMS, INC.
To: LOCKHEED MARTIN CORPORATION
Reel/Frame 027595/0457 →