Patent Assignment
Reel/Frame 027595/0457
Corrective Assignment to Correct the Conveying Assignor Previously Recorded on Reel 008732 Frame 0103. Assignor(S) Hereby Confirms the Assignor Is "Lockheed Martin Federal Systems, Inc.".
Recorded: 2012-01-25
Pages: 28
Assignor
LOCKHEED MARTIN FEDERAL SYSTEMS, INC.
Executed: 1997-06-20
Assignee
LOCKHEED MARTIN CORPORATION
6801 ROCKLEDGE DRIVE, BETHESDA, MARYLAND, 20817
Covered Properties
(2)
Method of Forming a Frontside Contact to the Silicon Substrate of a Soi Wafer
Patent:
5,314,841 →
Application:
08/054,992 →
Method to Radiation Harden the Buried Oxide in Silicon-on-Insulator Structures
Patent:
5,360,752 →
Application:
08/142,030 →
Related Assignments
(4)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 22, 2001
From: LOCKHEED MARTIN CORPORATION
To: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
Reel/Frame 012287/0780 →
Correction to the Recordation Cover Sheet of the Assignee Recorded at 008430/0312 on 12/23/1996
Dec 14, 2011
From: INTERNATIONAL BUSINESS MACHINES CORPORATION
To: LOCKHEED MARTIN FEDERAL SYSTEMS, INC.
Reel/Frame 027380/0841 →
Assignment of Assignor's Interest
Jan 8, 2012
From: BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION, INC.
To: OAL DATA LIMITED LIABILITY COMPANY
Reel/Frame 027497/0554 →
Corrective Assignment to Correct the Inventor Name "Nadium F. Haddad" Previously Recorded on Reel 006542 Frame 0707. Assignor(S) Hereby Confirms the Inventor Name Is "Nadim F. Haddad".
Jan 25, 2012
From: BRADY, FREDERICK T.; HADDAD, NADIM F.
To: INTERNATIONAL BUSINESS MACHINES CORPORATION
Reel/Frame 027595/0852 →