IP Library Assignment 027626/0174
Patent Assignment
Reel/Frame 027626/0174

Assignment of Assignor's Interest

Recorded: 2012-01-31 Pages: 2
Assignors
RYUZAKI, DAISUKE
Executed: 2011-12-27
NARITA, TAKENORI
Executed: 2011-12-13
HOSHI, YOUSUKE
Executed: 2011-12-14
IWANO, TOMOHIRO
Executed: 2011-12-19
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU, TOKYO, 163-0449, JAPAN
Covered Property (1)
Polishing Agent, Concentrated One-Pack Type Polishing Agent, Two-Pack Type Polishing Agent and Method for Polishing Substrate
Patent: 8,728,341 →
Application: 13/388,169 →
Publication: US 2012/0129346
Related Assignments (4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address of Assignee Apr 8, 2014
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 032640/0856 →
Change of Name Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →