Patent Assignment
Reel/Frame 027655/0540
Assignment of Assignor's Interest
Recorded: 2012-02-06
Pages: 4
Assignors
CHEN, CHIH-HAO
Executed: 2011-11-11
LEE, LONG HUA
Executed: 2011-11-22
SU, CHUN-HSING
Executed: 2011-11-11
TSAI, YI-LIN
Executed: 2011-11-11
YEH, KUNG-CHEN
Executed: 2011-11-11
WANG, CHUNG YU
Executed: 2011-11-11
HUNG, JUI-PIN
Executed: 2011-11-11
LIN, JING-CHENG
Executed: 2011-11-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Package for Three Dimensional Integrated Circuit