IP Library › Assignment 027663/0004
Patent Assignment
Reel/Frame 027663/0004

Assignment of Assignor's Interest

Recorded: 2012-02-07 Pages: 3
Assignors
LEE, KANG-HUA
Executed: 2010-09-08
LIU, WEN-CHENG
Executed: 2010-09-10
Assignee
EPOCH MATERIAL CO., LTD.
NO.2, LUKE 8TH RD., KAOHSIUNG SCIENCE PARK,, LU-CHUH HSIANG,, KAOHSIUNG COUNTY,, 82151, TAIWAN
Covered Property (1)
Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
Patent: 8,889,553 →
Application: 12/807,898 →
Publication: US 2011/0070736
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 10, 2022
From: EPOCH MATERIAL CO., LTD.
To: CMC MATERIALS TAIWAN CO., LTD.
Reel/Frame 060749/0266 →
Change of Name Jun 22, 2022
From: EPOCH MATERIAL CO., LTD.
To: CMC MATERIALS TAIWAN CO., LTD.
Reel/Frame 060392/0312 →
Assignment of Assignor's Interest Oct 12, 2023
From: CMC MATERIALS TAIWAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065203/0964 →