Patent Assignment
Reel/Frame 060392/0312
Change of Name
Recorded: 2022-06-22
Pages: 14
Assignor
EPOCH MATERIAL CO., LTD.
Executed: 2020-11-20
Assignee
CMC MATERIALS TAIWAN CO., LTD.
NO. 2, LUKE 8TH RD., SOUTHERN TAIWAN SCIENCE PARK, LUZHU DISTRICT, KAOHSIUNG CITY, 1182151, TAIWAN
Covered Properties
(3)
Aqueous Cleaning Composition for Semiconductor Copper Processing
Aqueous Cleaning Composition for Semiconductor Copper Processing
Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
Related Assignments
(5)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
May 18, 2006
From: CHEN, CHIEN CHING; LIU, WEN CHENG; SHIUE, JING-CHIUAN; HUO, TENG YAN
To: EPOCH MATERIAL CO., LTD.
Reel/Frame 017918/0048 →
Assignment of Assignor's Interest
Mar 14, 2008
From: CHEN, CHIEN CHING; LIU, WEN CHENG; CHUANG, TSUNG HSIEN; CHEN, JUI CHING
To: EPOCH MATERIAL CO., LTD.,
Reel/Frame 020650/0662 →
Assignment of Assignor's Interest
Feb 7, 2012
From: LEE, KANG-HUA; LIU, WEN-CHENG
To: EPOCH MATERIAL CO., LTD.
Reel/Frame 027663/0004 →
Change of Name
May 10, 2022
From: EPOCH MATERIAL CO., LTD.
To: CMC MATERIALS TAIWAN CO., LTD.
Reel/Frame 060749/0266 →
Assignment of Assignor's Interest
Oct 12, 2023
From: CMC MATERIALS TAIWAN CO., LTD.
To: ENTEGRIS, INC.
Reel/Frame 065203/0964 →