IP Library › Assignment 027701/0010
Patent Assignment
Reel/Frame 027701/0010

Assignment of Assignor's Interest

Recorded: 2012-02-14 Pages: 2
Assignors
RADWAN, MOHAMMED
Executed: 2011-06-21
ZINKE, MATTHIAS
Executed: 2011-06-21
Assignee
GLOBALFOUNDRIES INC.
MAPLES CORPORATE SERVICES LIMITED, PO BOX 309, UGLAND HOUSE, GRAND CAYMAN, KY1-1104, CAYMAN ISLANDS
Covered Property (1)
Technique for Reducing Plasma-Induced Etch Damage During the Formation of Vias in Interlayer Dielectrics by Modified RF Power Ramp-Up
Patent: 9,018,102 →
Application: 13/372,901 →
Publication: US 2012/0214305
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 29, 2018
From: GLOBALFOUNDRIES INC.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 049490/0001 →
Release of Security Interest Nov 20, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES INC.
Reel/Frame 054636/0001 →
Release of Security Interest May 12, 2021
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES U.S. INC.
Reel/Frame 056987/0001 →