Patent Assignment
Reel/Frame 027704/0263
Assignment of Assignor's Interest
Recorded: 2012-02-14
Pages: 2
Assignors
ODA, TAKASHI
Executed: 2012-02-01
TAKAMOTO, NAOHIDE
Executed: 2012-02-01
MATSUMURA, TAKESHI
Executed: 2012-02-01
Assignee
NITTO DENKO CORPORATION
1-1-2, SHIMOHOZUMI, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property
(1)
Method of Manufacturing Semiconductor Device Having a Bumped Wafer and Protective Layer