IP Library › Assignment 027718/0789
Patent Assignment
Reel/Frame 027718/0789

Assignment of Assignor's Interest

Recorded: 2012-02-16 Pages: 5
Assignors
SENDA, TAKESHI
Executed: 2012-02-03
ISOGAI, HIROMICHI
Executed: 2012-01-20
TOYODA, EIJI
Executed: 2011-12-22
ARAKI, KOJI
Executed: 2012-02-06
AOKI, TATSUHIKO
Executed: 2012-02-03
SUDO, HARUO
Executed: 2012-02-03
IZUNOME, KOJI
Executed: 2012-02-05
SAITO, HIROYUKI
Executed: 2012-02-03
MAEDA, SUSUMU
Executed: 2012-01-31
KASHIMA, KAZUHIKO
Executed: 2012-02-13
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property (1)
Silicon Wafer and Method for Heat-Treating Silicon Wafer
Patent: 8,999,864 →
Application: 13/322,080 →
Publication: US 2012/0139088
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →