Patent Assignment
Reel/Frame 027721/0717
Assignment of Assignor's Interest
Recorded: 2012-02-17
Pages: 3
Assignors
LI, ZHEN-YU
Executed: 2012-02-11
HSIA, HSING-KUO
Executed: 2012-02-14
KUO, HAO-CHUNG
Executed: 2012-02-14
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Method of Growing a High Quality Iii-V Compound Layer on a Silicon Substrate
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0571 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0929 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →