Patent Assignment
Reel/Frame 027726/0706
Assignment of Assignor's Interest
Recorded: 2012-02-17
Pages: 7
Assignors
RAMASAMY, ANANDAN
Executed: 2012-02-14
GAN, KAHWEE
Executed: 2011-12-20
LOOI, HK
Executed: 2011-12-20
GANI, DAVID
Executed: 2011-12-20
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Embedded Wafer Level Optical Package Structure and Manufacturing Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.