Patent Assignment
Reel/Frame 027801/0435
Assignment of Assignor's Interest
Recorded: 2012-02-29
Pages: 9
Assignors
CHAU, ELLIS
Executed: 2012-02-24
CO, REYNALDO
Executed: 2012-02-24
ALATORRE, ROSEANN
Executed: 2012-02-24
DAMBERG, PHILIP
Executed: 2012-02-24
WANG, WEI-SHUN
Executed: 2012-02-24
YANG, SE YOUNG
Executed: 2012-02-24
ZHAO, ZHIJUN
Executed: 2012-02-24
Assignee
INVENSAS CORPORATION
2702 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Package-On-Package Assembly with Wire Bond Vias
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest
Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061387/0680 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →