IP Library › Assignment 061387/0680
Patent Assignment
Reel/Frame 061387/0680

Certificate of Conversion & Change of Name

Recorded: 2022-09-07 Pages: 6
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Properties (16)
Package-On-Package Assembly with Wire Bond Vias
Patent: 9,105,483 →
Application: 13/404,408 →
Publication: US 2013/0093087
Package-On-Package Assembly with Wire Bond Vias
Patent: 8,404,520 →
Application: 13/404,458 →
Publication: US 2013/0095610
Package-On-Package Assembly with Wire Bond Vias
Patent: 8,836,136 →
Application: 13/405,108 →
Publication: US 2013/0093088
Advanced Device Assembly Structures and Methods
Patent: 9,024,205 →
Application: 13/692,148 →
Publication: US 2014/0153210
Package-On-Package Assembly with Wire Bond Vias
Patent: 9,041,227 →
Application: 13/795,811 →
Publication: US 2013/0200533
Package-On-Package Assembly with Wire Bond Vias
Patent: 9,252,122 →
Application: 13/966,636 →
Publication: US 2013/0328219
Fine Pitch Bva Using Reconstituted Wafer with Area Array Accessible for Testing
Patent: 9,583,411 →
Application: 14/157,790 →
Publication: US 2015/0206815
Package-On-Package Assembly with Wire Bond Vias
Patent: 9,761,558 →
Application: 14/718,719 →
Publication: US 2015/0255424
Fine Pitch Bva Using Reconstituted Wafer with Area Array Accessible for Testing
Patent: 9,837,330 →
Application: 15/422,887 →
Publication: US 2017/0148696
3D-Interconnect
Application: 15/493,917 →
Publication: US 2018/0308813
Embedded Organic Interposers for High Bandwidth
Application: 15/499,557 →
Publication: US 2018/0315735
Package-On-Package Assembly with Wire Bond Vias
Application: 15/699,288 →
Publication: US 2018/0026007
Fine Pitch Bva Using Reconstituted Wafer with Area Array Accessible for Testing
Application: 15/827,550 →
Publication: US 2018/0082916
3D-Interconnect
Application: 16/245,925 →
Publication: US 2019/0148324
Embedded Organic Interposer for High Bandwidth
Application: 16/555,127 →
Publication: US 2019/0385978
Package-on-package Assembly With Wire Bond Vias
Application: 16/999,601 →
Publication: US 2021/0035948
Related Assignments (21)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Feb 29, 2012
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 027801/0435 →
Assignment of Assignor's Interest Feb 29, 2012
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 027801/0421 →
Assignment of Assignor's Interest Feb 29, 2012
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 027801/0411 →
Assignment of Assignor's Interest Jan 31, 2013
From: UZOH, CYPRIAN EMEKA
To: INVENSAS CORPORATION
Reel/Frame 029741/0212 →
Assignment of Assignor's Interest Jan 17, 2014
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 031996/0717 →
Assignment of Assignor's Interest Oct 22, 2014
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 034010/0525 →
Assignment of Assignor's Interest Jan 6, 2015
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 034644/0831 →
Assignment of Assignor's Interest May 22, 2015
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 035697/0278 →
Security Interest Dec 2, 2016
From: INVENSAS CORPORATION; TESSERA, INC.; TESSERA ADVANCED TECHNOLOGIES, INC.; ZIPTRONIX, INC.
To: ROYAL BANK OF CANADA, AS COLLATERAL AGENT
Reel/Frame 040797/0001 →
Assignment of Assignor's Interest Feb 3, 2017
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 041168/0045 →
Assignment of Assignor's Interest Apr 27, 2017
From: DELACRUZ, JAVIER A.; HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 042169/0106 →
Assignment of Assignor's Interest May 31, 2017
From: CHIA, CHOK J.; LOW, QWAI H.; VARIOT, PATRICK
To: INVENSAS CORPORATION
Reel/Frame 042549/0060 →
Assignment of Assignor's Interest Sep 11, 2017
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 043545/0449 →
Assignment of Assignor's Interest Dec 1, 2017
From: KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 044274/0249 →
Assignment of Assignor's Interest Aug 29, 2019
From: DELACRUZ, JAVIER A.; HABA, BELGACEM
To: INVENSAS CORPORATION
Reel/Frame 050211/0847 →
Assignment of Assignor's Interest Feb 4, 2020
From: CHIA, CHOK J.; LOW, QWAI H.; VARIOT, PATRICK
To: INVENSAS CORPORATION
Reel/Frame 051715/0167 →
Security Interest Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Release of Security Interest Jun 11, 2020
From: ROYAL BANK OF CANADA
To: TESSERA, INC.; INVENSAS BONDING TECHNOLOGIES, INC. (F/K/A ZIPTRONIX, INC.); FOTONATION CORPORATION (F/K/A DIGITALOPTICS CORPORATION AND F/K/A DIGITALOPTICS CORPORATION MEMS); INVENSAS CORPORATION
Reel/Frame 052920/0001 →
Assignment of Assignor's Interest Aug 24, 2020
From: CHAU, ELLIS; CO, REYNALDO; ALATORRE, ROSEANN; DAMBERG, PHILIP
To: INVENSAS CORPORATION
Reel/Frame 053575/0462 →
Security Interest May 3, 2023
From: ADEIA GUIDES INC.; ADEIA IMAGING LLC; ADEIA MEDIA HOLDINGS LLC; ADEIA MEDIA SOLUTIONS INC.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 063529/0272 →
Change of Name Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →