Patent Assignment
Reel/Frame 051715/0167
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 3
Assignors
CHIA, CHOK J.
Executed: 2017-05-18
LOW, QWAI H.
Executed: 2017-05-18
VARIOT, PATRICK
Executed: 2017-05-18
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
3D-Interconnect
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Sep 7, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 061387/0680 →
Change of Name
Oct 2, 2024
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 069087/0330 →