Patent Assignment
Reel/Frame 027812/0380
Assignment of Assignor's Interest
Recorded: 2012-03-06
Pages: 3
Assignor
JIN, YONGGANG
Executed: 2012-01-06
Assignee
STMICROELECTRONICS PTE LTD.
28 ANG MO KIO, INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Apparatus and Method for Placing Solder Balls
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.