Assignment of Assignor's Interest

Recorded: 2012-03-08 Pages: 3

Assignor

OGLESBEE, JOHN W.

Executed: 2001-11-30

Assignee

MOTOROLA, INC.

1303 E. ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196-1079

Covered Property (1)

Flip Chip Mounted to Thermal Sensing Element Through the Back Side of the Chip

Patent: 7,205,672 →

Application: 10/740,239 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.