Change of Name

Recorded: 2012-03-08 Pages: 7

Assignor

MOTOROLA, INC

Executed: 2011-01-04

Assignee

MOTOROLA SOLUTIONS, INC.

1303 E. ALGONQUIN ROAD, SCHAUMBURG, ILLINOIS, 60196

Covered Property (1)

Flip Chip Mounted to Thermal Sensing Element Through the Back Side of the Chip

Patent: 7,205,672 →

Application: 10/740,239 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.