Patent Assignment
Reel/Frame 027835/0206
Assignment of Assignor's Interest
Recorded: 2012-03-09
Pages: 2
Assignors
LEE, JIN-WOO
Executed: 2012-03-09
JANG, JAE-HOON
Executed: 2012-03-09
LEE, DONG-HOON
Executed: 2012-03-09
KIM, JAE-HA
Executed: 2012-03-09
Assignee
SAMSUNG TECHWIN CO., LTD.
28 SUNGJU-DONG, KYONGSANGNAM-DO, GYEONGGI-DO, CHANGWON-CITY, KOREA, REPUBLIC OF
Covered Property
(1)
Method of Manufacturing Lead Frame for Light-Emitting Device Package and Light-Emitting Device Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.