IP Library › Assignment 027840/0083
Patent Assignment
Reel/Frame 027840/0083

Assignment of Assignor's Interest

Recorded: 2012-03-12 Pages: 6
Assignors
WEI, MING-TE
Executed: 2012-03-05
HUANG, SHIN-CHUAN
Executed: 2012-03-05
HUNG, YU-HSIANG
Executed: 2012-03-05
TSAO, PO-CHAO
Executed: 2012-03-05
LIANG, CHIA-JUI
Executed: 2012-03-05
CHEN, MING-TSUNG
Executed: 2012-03-05
LIANG, CHIA-WEN
Executed: 2012-03-05
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property (1)
Semiconductor Structure and Fabrication Method Thereof
Patent: 9,136,348 →
Application: 13/417,337 →
Publication: US 2013/0234261