Patent Assignment
Reel/Frame 027875/0570
Assignment of Assignor's Interest
Recorded: 2012-03-16
Pages: 3
Assignors
NAKAKO, HIDEO
Executed: 2012-01-30
YAMAMOTO, KAZUNORI
Executed: 2012-01-30
KUMASHIRO, YASUSHI
Executed: 2012-01-24
YOKOSAWA, SHUNYA
Executed: 2012-01-25
MASUDA, KATSUYUKI
Executed: 2012-01-30
EJIRI, YOSHINORI
Executed: 2012-01-26
INADA, MAKI
Executed: 2012-01-30
KURODA, KYOKO
Executed: 2012-01-25
Assignee
HITACHI CHEMICAL COMPANY, LTD.
1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU,, TOKYO, JAPAN
Covered Property
(1)
Copper Metal Film, Method for Producing Same, Copper Metal Pattern, Conductive Wiring Line Using the Copper Metal Pattern, Copper Metal Bump, Heat Conduction Path, Bonding Material, and Liquid Composition
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Address
Aug 18, 2016
From: HITACHI CHEMICAL COMPANY, LTD.
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 039725/0334 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →