Patent Assignment
Reel/Frame 027913/0052
Assignment of Assignor's Interest
Recorded: 2012-03-22
Pages: 2
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Novel Bump Structures for Multi-Chip Packaging