Patent Assignment
Reel/Frame 027915/0146
Assignment of Assignor's Interest
Recorded: 2012-03-23
Pages: 3
Assignors
CHEAH, BOK ENG
Executed: 2009-12-08
PERIAMAN, SHANGGAR
Executed: 2009-12-08
OOI, KOOI CHI
Executed: 2009-12-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95052
Covered Property
(1)
High-Density Inter-Package Connections for Ultra-Thin Package-on-Package Structures, and Processes of Forming Same