Patent Assignment
Reel/Frame 027931/0442
Confirmatory Assignment
Recorded: 2012-03-26
Pages: 3
Assignor
PHILIPS SEMICONDUCTORS INC.
Executed: 2012-03-26
Assignee
NXP B.V.
HIGH TECH CAMPUS 60, EINDHOVEN, 5656 AG, NETHERLANDS
Covered Property
(1)
Package Structure Having Accessible Chip
Patent:
5,491,362 →
Application:
08/106,146 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2009
From: PHILIPS SEMICONDUCTORS INC.
To: NXP B.V.
Reel/Frame 022973/0239 →
Change of Name
Jul 18, 2009
From: VLSI TECHNOLOGY, INC.
To: PHILIPS SEMICONDUCTORS VLSI INC.
Reel/Frame 022973/0248 →
Change of Name
Jul 18, 2009
From: PHILIPS SEMICONDUCTORS VLSI INC.
To: PHILIPS SEMICONDUCTORS INC.
Reel/Frame 022973/0254 →
Assignment of Assignor's Interest
Mar 13, 2012
From: HAMZEHDOOST, AHMAD; MORA, LEONARD L.
To: VLSI TECHNOLOGY, INC.
Reel/Frame 027855/0467 →
Assignment of Assignor's Interest
Apr 16, 2012
From: NXP B.V.
To: SEONG CAPITAL LTD. LIMITED LIABILITY COMPANY
Reel/Frame 028049/0649 →