Patent Assignment
Reel/Frame 027959/0424
Assignment of Assignor's Interest
Recorded: 2012-03-29
Pages: 4
Assignors
CHEN, CHIEN-AN
Executed: 2012-03-07
LIU, WEN-JIUN
Executed: 2012-03-07
LIN, CHUN-CHIEH
Executed: 2012-03-07
SU, HUNG-WEN
Executed: 2012-03-07
TSAI, MING HSING
Executed: 2012-03-07
JANG, SYUN-MING
Executed: 2012-03-07
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Mechanisms of Forming Damascene Interconnect Structures