Patent Assignment
Reel/Frame 027974/0701
Assignment of Assignor's Interest
Recorded: 2012-04-02
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Led Module and Method of Bonding Thereof
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 1, 2011
From: YEH, WEI-YU
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
Reel/Frame 027155/0531 →
Change of Name
Nov 30, 2015
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037172/0212 →
Merger
Nov 30, 2015
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037437/0049 →
Assignment of Assignor's Interest
Dec 17, 2025
From: EPISTAR CORPORATION
To: TAU CETI VENTURES LLC
Reel/Frame 073969/0972 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →