IP Library › Assignment 027976/0315
Patent Assignment
Reel/Frame 027976/0315

Assignment of Assignor's Interest

Recorded: 2012-03-16 Pages: 3
Assignors
SENDA, TAKESHI
Executed: 2012-03-06
ARAKI, KOJI
Executed: 2012-03-06
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, 141-0032, JAPAN
Covered Property (1)
Thermal Treatment Method of Silicon Wafer and Silicon Wafer
Patent: 9,059,099 →
Application: 13/421,748 →
Publication: US 2012/0241912
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →