Patent Assignment
Reel/Frame 027981/0796
Assignment of Assignor's Interest
Recorded: 2012-04-03
Pages: 2
Assignors
CHEN, CHIH-HUA
Executed: 2012-01-12
CHEN, CHEN-SHIEN
Executed: 2012-01-12
HSIAO, CHING-WEN
Executed: 2012-01-12
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77 R.O.C., TAIWAN
Covered Property
(1)
Through-Assembly via Modules and Methods for Forming the Same