Patent Assignment
Reel/Frame 027989/0926
Assignment of Assignor's Interest
Recorded: 2012-04-04
Pages: 3
Assignor
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
Executed: 2012-03-01
Assignee
TSMC SOLID STATE LIGHTING LTD.
9, LI-HSIN 4TH ROAD, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Methods of Fabricating Light Emitting Diode Packages
Patent:
8,241,932 →
Application:
13/050,549 →
Related Assignments
(5)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 17, 2011
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN; HSIA, HSING-KO; KUO, HUNG-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 025976/0256 →
Corrective Assignment to Correct the Spelling of the Third Assignor's Name Previously Recorded on Reel 025976 Frame 0256. Assignor(S) Hereby Confirms the Third Assignor's Name Should Be Hsing-Kuo Hsia.
May 5, 2011
From: YU, CHIH-KUANG; CHERN, CHYI SHYUAN; HSIA, HSING-KUO; KUO, HUNG-YI
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 026227/0335 →
Merger
Feb 23, 2016
From: CHIP STAR LTD.
To: EPISTAR CORPORATION
Reel/Frame 037805/0600 →
Change of Name
Feb 23, 2016
From: TSMC SOLID STATE LIGHTING LTD.
To: CHIP STAR LTD.
Reel/Frame 037809/0983 →
Change of Name
Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →