IP Library › Assignment 027994/0679
Patent Assignment
Reel/Frame 027994/0679

Assignment of Assignor's Interest

Recorded: 2012-04-05 Pages: 5
Assignors
SENDA, TAKESHI
Executed: 2012-02-14
ISOGAI, HIROMICHI
Executed: 2012-02-29
TOYODA, EIJI
Executed: 2012-01-28
MURAYAMA, KUMIKO
Executed: 2012-02-15
ARAKI, KOJI
Executed: 2012-02-15
AOKI, TATSUHIKO
Executed: 2012-02-14
SUDO, HARUO
Executed: 2012-02-14
IZUNOME, KOJI
Executed: 2012-02-18
MAEDA, SUSUMU
Executed: 2012-02-03
KASHIMA, KAZUHIKO
Executed: 2012-02-22
Assignee
COVALENT MATERIALS CORPORATION
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU, TOKYO, JAPAN
Covered Property (1)
Method for Heat Treating a Silicon Wafer
Patent: 8,399,341 →
Application: 13/387,125 →
Publication: US 2012/0184091
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 11, 2013
From: COVALENT MATERIALS CORPORATION
To: COVALENT SILICON CORPORATION
Reel/Frame 029962/0497 →
Change of Name Mar 13, 2013
From: COVALENT SILICON CORPORATION
To: GLOBALWAFERS JAPAN CO., LTD.
Reel/Frame 029991/0421 →